Method and apparatus to support process tool modules in processing tools in a cleanspace fabricator

ABSTRACT

The present invention provides various aspects of support for a processing tool in a fabrication facility capable of routine placement and replacement of processing tools and component assemblies of the tools. Support aspects include a support structure for component assemblies and a quick disconnect flange which facilitates connecting and disconnect of electrical, liquid and gas utilities to a tool component placed in the processing tool.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. patent application Ser. No.12/691,623, filed Jan. 21, 2010, as a continuation application. The U.S.patent application Ser. No. 12/691,623, in turn claims priority to U.S.Provisional Patent Application Ser. No. 61/146,183, filed Jan. 21, 2009.The contents are relied upon and hereby incorporated by reference. Thisapplication also claims priority to the U.S. patent application Ser. No.11/502,689, filed Aug. 12, 2006 and entitled: “Method and Apparatus tosupport a Cleanspace Fabricator” as a continuation in part application.The contents are relied upon and hereby incorporated by reference. TheU.S. patent application Ser. No. 11/502,689 in turn claims priority tothe following Provisional Applications: Provisional Application, Ser.No. 60/596,343, filed Sep. 18, 2005 and entitled: “Specialized Methodsfor Substrate Processing for a Clean Space Where Processing Tools areVertically Oriented”; and also Provisional Application, Ser. No.60/596,173, filed Sep. 6, 2005 and entitled: “Method and Apparatus forSubstrate Handling for a Clean Space Where Processing Tools areReversibly Removable”; and also Provisional Application, Ser. No.60/596,099, filed Aug. 31, 2005 and entitled: “Method and Apparatus fora Single Substrate Carrier For Semiconductor Processing”; and alsoProvisional Application, Ser. No. 60/596,053 filed Aug. 26, 2005 andentitled: “Method and Apparatus for an Elevator System for Tooling andPersonnel for a Multilevel Cleanspace/Fabricator”; and also ProvisionalApplication, Ser. No. 60/596,035 filed Aug. 25, 2005 and entitled:“Method and Apparatus for a Tool Chassis Support System for Simplified,Integrated and Reversible Installation of Process Tooling”; and alsoProvisional Application, Ser. No. 60/595,935 filed Aug. 18, 2005, andentitled: “Method and Apparatus for the Integrated, Flexible and EasilyReversible Connection of Utilities, Chemicals and Gasses to ProcessTooling.” The contents of these heretofore mentioned applications arerelied upon and hereby incorporated by reference. This application alsoclaims priority to the U.S. patent application Ser. No. 14/024,335,filed Sep. 11, 2013 and entitled “Method and Apparatus for a CleanspaceFabricator” as a continuation in part application. The U.S. patentapplication Ser. No. 14/024,335 in turn claims priority to the U.S.patent application Ser. No. 11/933,280, filed Oct. 31, 2007 and entitled“Method and Apparatus for a Cleanspace Fabricator” now U.S. Pat. No.8,641,824 as a divisional application. The contents are relied upon andhereby incorporated by reference. The U.S. patent application Ser. No.11/933,280 in turn claims priority to the U.S. patent application Ser.No. 11/156,205, filed Jun. 18, 2005 and entitled “Method and Apparatusfor a Cleanspace Fabricator” now U.S. Pat. No. 7,513,822 as a divisionalapplication. The contents are relied upon and hereby incorporated byreference. This application also claims priority to the U.S. patentapplication Ser. No. 13/398,371 filed Feb. 16, 2012 and entitled“Methods and Apparatus for Vertically Orienting Substrate ProcessingTools in a Clean Space” as a continuation in part application. Thecontents are relied upon and hereby incorporated by reference. The U.S.patent application Ser. No. 13/398,371 in turn claims priority to theU.S. patent application Ser. No. 11/520,975, filed Sep. 14, 2006 andentitled “Methods and Apparatus for Vertically Orienting SubstrateProcessing Tools in a Clean Space” now U.S. Pat. No. 8,229,585 as acontinuation in part application. The contents are relied upon andhereby incorporated by reference.

FIELD OF THE INVENTION

The present invention relates to apparatus and methods which supportprocessing tools used in conjunction with cleanspace fabricators. Morespecifically, the present invention relates to fabricator processingtools with one or more component assemblies routinely replaceable andlocated at least partially within a cleanspace based fabricator.

BACKGROUND OF THE INVENTION

A known approach to advanced technology fabrication of materials such assemiconductor substrates, is to assemble a manufacturing facility as a“cleanroom.” In such cleanrooms, processing tools are arranged toprovide aisle space for human operators or automation equipment.Exemplary cleanroom design is described in: “Cleanroom Design, SecondEdition,” edited by W. Whyte, published by John Wiley & Sons, 1999, ISBN0-471-94204-9, (herein after referred to as “the Whyte text”).

Cleanroom design has evolved over time to include locating processingstations within clean hoods. Vertical unidirectional airflow can bedirected through a raised floor, with separate cores for the tools andaisles. It is also known to have specialized mini-environments whichsurround only a processing tool for added space cleanliness. Anotherknown approach includes the “ballroom” approach, wherein tools,operators and automation all reside in the same cleanroom.

Evolutionary improvements have enabled higher yields and the productionof devices with smaller geometries. However, known cleanroom design hasdisadvantages and limitations.

For example, as the size of tools has increased and the dimensions ofcleanrooms have increased, the volume of cleanspace that is controlledhas concomitantly increased. As a result, the cost of building thecleanspace, and the cost of maintaining the cleanliness of suchcleanspace, has increased considerably.

Tool installation in a cleanroom can be difficult. The initial “fit up”of a “fab” with tools, when the floor space is relatively empty, can berelatively straightforward. However, as tools are put in place and afabricator begins to process substrates, it can become increasinglydifficult and disruptive of job flow, to either place new tools orremove old ones. Likewise it has been difficult to remove a sub-assemblyor component that makes up a fabricator tool in order to performmaintenance or replace such a subassembly or component of the fabricatortool. It would be desirable therefore to reduce installationdifficulties attendant to dense tool placement while still maintainingsuch density, since denser tool placement otherwise affords substantialeconomic advantages relating to cleanroom construction and maintenance.

It would be desirable to have manufacturing facilities for cleanenvironment fabrication that facilitate sufficient access to componentswhich make up fabricator tools for replacement or maintenance of thecomponents. The prior art defines novel designs of the cleanenvironments, called cleanspaces which address these needs.

SUMMARY OF THE INVENTION

Accordingly, building on the types of environments defined in previouspatents, there are a subset of cleanspace fabricators where the processtooling is large, as would be the case for tools that process 8 inch andlarger substrates, the reversibly removable aspect of tooling is lessrelevant than for fabricators where the tooling is significantlysmaller. Nevertheless, even for the large tool design the generalaspects of novel cleanspace designs apply. The fact that all theprocessing tools reside on a peripheral location of a clean space makesit possible to access the processing tool in flexible and easy manners.Accordingly, the present invention provides description of how thepreviously discussed strategies can be taken one step further wherereversibly removable items in the fabricator environment includeportions of a processing tool. The processing tool can be placed witheach port inside the first cleanspace and the body of each processingtool can be placed at a location peripheral to the cleanspace boundarywall, such that at least a portion of the tool body is outside thecleanspace. Furthermore, within the body of the processing tool can beadditionally defined subsections which can be removed from an outsideaccess in a straightforward manner. Therefore, the portion of theprocessing tool that defines the processing environment, for example,could be made to be an easily removable and replaceable part.

It is logically possible for the concept of significant tool componentmodules being routinely replaceable to also cover the needs offabricators where the tooling is small and supports smaller substrates.In such cases, the component module could be a small entity butnevertheless define a subset of the removable tooling unit as well.There may be operational advantages under certain circumstances forreplacing just the module and not the entire tool.

The present invention can therefore include methods and apparatus for:supporting the components of processing tools, supplying utilities tothe individual components of processing tools, transporting materialsfrom the tool body into the individual component of the processing tooland placing components of a processing tool into and out of physicalcommunication with the cleanspace.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, that are incorporated in and constitute apart of this specification, illustrate several embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention:

FIG. 1 Overview of Chassis Embodiment

FIG. 2 Front View with Tool Body Placed

FIG. 3 Rear View with Tool Body Placed

FIG. 4 Example Placement in an Example Fab Design

FIG. 5 Overview of Chassis—Not Extended

FIG. 6 illustrates an example tool body elevation view showing asubstrate handler.

FIG. 7 illustrates a close up view of substrate handler indicatinginternal components in context with a tool body.

FIG. 8 Substrate Handler Internal Components.

FIG. 9 illustrates a tool body with substrate handler attached to anexemplary fabricator.

FIG. 10 illustrates a rear view plane view of an exemplary fabricatorwith back walls removed and thereby showing multiple tool ports andfabricator automation.

FIG. 11 illustrates an overview of a cleanspace environment with areversibly removable component module demonstrated in the installedconfiguration.

FIG. 12 illustrates multiple components of a processing tool.

FIG. 13 illustrates a close up view of a processing tool with acomponent module in a position of being removed or replaced.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The present invention relates to methods and apparatus to support acleanspace environment within which a material, such as an integratedcircuit substrate, can be processed. The support can include methods andapparatus which allow a portion of a tool used to process the materialto be accessible from within a cleanspace in which the material isprocessed. An additional portion of the processing tool can remainoutside of the cleanspace environment in which a material is processed.In addition, the present invention provides for methods and apparatus tofacilitate installation, removal and maintenance of processing toolsused to process the material.

Traditionally, when installing a processing tool into a cleanspace, suchas a semiconductor fabricator, riggers had to place the processing toolin a designated position where the processing tool remained in place forits entire time in the fabricator. Repair of the processing tool, orreplacement of a sub-assembly of the processing tool took place withinthe confine of the cleanspace and thereby often affected the integrityof the cleanspace and made it difficult for the technicians having towork with appropriate cleanspace protective clothing. The presentinvention provides for an alternative strategy wherein processing toolscan be routinely placed and removed from a fabricator location. Inaddition, ease of access to a processing tool can facilitate one or bothof placement and replacement of sub-assemblies of the processing toolsform without the cleanspace perimeter and with minimal impact on theintegrity of the cleanspace.

According to the present invention, routine placement and removabilityof processing tools in a fabricator is made possible by locating thefabricator processing tools on the periphery of the clean spaceenvironment. Generally, a port portion of the processing tool extendsinto the cleanspace while a body portion of the processing tool remainson an exterior periphery to the cleanspace. The location of theprocessing tool facilitates access to sub-assemblies of processing toolsfor removal and placement of a subassembly of the processing tool whilestill maintaining the integrity of the cleanspace. Components orsubassemblies of process tooling are designed in a modular fashion suchthat a component or subassembly can been replaced in these cleanspaceenvironments in an analogous fashion to the placement and replacement ofentire tool bodies.

Following, reference will be made in detail to different aspects of somepreferred embodiments of the invention, examples of which areillustrated in the accompanying drawings. Wherever possible, the samereference numbers will be used throughout the drawings to refer to thesame or like parts. A Glossary of Selected Terms is included at the endof this Detailed Description.

Referring now to FIG. 1, a chassis 101 is illustrated according to someembodiments of the present invention. Base plates are attached to asliding rail system 113 provide an installation location for aprocessing tool body (not illustrated). Base plate 111 is physicallyfixed in an appropriate location of a fabricator. In some embodiments,base plate 111 would not interact directly with the tool body, however,in some embodiments, a tool body can be fixedly attached to the baseplate 111. In both embodiments, chassis plate 110 can physically supporta tool body mounted on the chassis 101.

A tool body may be mounted so that a portion, or the entirety of thetool is contained within the cleanspace. In some embodiments, a portioncontained within the cleanspace may be as small as a port for receivinga substrate or other material to be processed by the processing machine

In FIG. 1, the orientation of two plates is shown with the platesseparated. The chassis 101 can have multiple service locationorientations. A first location, as shown in the drawing, can involve anextended location, such that the placement and removal of a tool bodyfrom the chassis plate 110 can occur in an exposed location. An exposedlocation, for example, can facilitate placement of a new tool onto thechassis plate 110. A second service location allows the chassis 101 torelocate such that both chassis plate 110 and base plate 111 are closetogether. An illustration of an exemplary second service location isprovided in FIG. 5 including plates 510 and 511.

In some embodiments, tabs 120 may stick out of the top of the chassisplate 110. The tabs 120 may serve one or more purposes. As a physicalextension, the tabs 120 will have a corresponding indentation (notillustrated) in the mating plate or a surface of a tool body 201 to beplaced on the tabs 120. As the tool body 201 is lowered over the chassisplate 110, the tool body 201 will reach a location as defined by tabs120. In some embodiments, the tabs 120 can additionally provideelectrical connection between the chassis plate 110 and the tool body201. Electrical connection can serve one or more of the purposes of:electrical power and electrical data signal.

In some embodiments, a wireless interface 123 can provide wirelesselectrical connection between the tool body and the chassis. Thewireless interface 123 can be redundant to hardwire data connections ortake the place of hardwire data connection. The wireless interface canalso be utilized for other electrical connections, as discussed for tabs120. In some embodiments, a wireless interface 123 can provide one orboth of electrical power and data communication.

Connections for non-electrical utilities 121 can also be provided, asdiscussed more fully below in the section entitled Utility FlangeConnectors. Connections for non-electrical utilities 121 can be used fordefining a connection, for example, of one or more of: gas, vacuum,fluids waste lines, compresses air, deionized water, chemicals and thelike. Various conduits 112 can carry these utilities to the connectionsfor non-electrical utilities 121 and be routed, for example, through thechassis 101. The conduits 112 can be connected to appropriate facilitysupply systems, airflow systems and drains to provide for safeoperation.

In general a cleanspace may be classified according to standards set forcleanrooms. However, those skilled in the art will recognize accordingto the preceding description, that a cleanspace is not limited to theconfines of a “room”. Cleanspaces may be circular, rectangular, andsquare, of a generally peripheral nature with a core portion dedicatedto utilities or other configuration. Other shapes can include an arc orcurved wall design. The cleanspace may be a single “story” high ormultiple “stories” wherein a story is defined by a vertical placement ofa processing machine. Similarly, processing machines may be relativelysmall, such as for a four inch wafer, or even smaller, such as, forexample, a one or two inch wafer; or processing machines for largerwafers, such as, for example an eight inch wafer or sixteen inch wafer.

Classifications can be based, for example, according to the number andsize of particles permitted per volume of air. Large numbers like “class100” or “class 1000” refer to US FED STD 209E, and denote the number ofparticles of size 0.5 .mu.m or larger permitted per cubic foot of air.The standard also allows interpolation, so it is possible to describee.g. “class 2000”.

Small numbers can refer to ISO 14644-1 standards, which specify thedecimal logarithm of the number of particles 0.1 .mu.m or largerpermitted per cubic meter of air. So, for example, an ISO class 5 cleanroom has at most 10.sup.5=100,000 particles per m.sup.3.

For example, a cleanspace meeting a US FED STD 209E cleanroom standardcan include:

Particles/ft³ Class 0.1 μm 0.2 μm 0.3 μm 0.5 μm 5 μm 1 35 7 3 1 10 35075 30 10 100 750 300 100 1,000 1,000 7 10,000 10,000 70 100,000 100,000700

In addition, a cleanspace according to ISO 14644-1 cleanroom standardscan include a space clean according to the following standards:

particles/m³ Class 0.1 μm 0.2 μm 0.3 μm 0.5 μm 1 μm 5 μm ISO 1 10 2 ISO2 100 24 10 4 ISO 3 1,000 237 102 35 8 ISO 4 10,000 2,370 1,020 352 83ISO 5 100,000 23,700 10,200 3,520 832 29 ISO 6 1,000,000 237,000 102,00035,200 8,320 293 ISO 7 352,000 83,200 2,930 ISO 8 3,520,000 832,00029,300 ISO 9 35,200,000 8,320,000 293,000

As applied to a cleanspace, the following classes are generallyequivalent, although the testing standards for each may differ:

particles/m³ Class 0.5 μm 5 μm 10 μm Class 1 3,000 0 Class 2 300,0003,000 30

Referring now to FIG. 2, a tool body 201 can be placed onto the chassisplate 110. The tool body 201 is illustrated in a generic box, however,any type of processing tool, such as those required for semiconductormanufacture, is within the scope of the invention. In some embodiments,the underside of a tool body 201 can include a mating plate whichphysically interfaces with a chassis top plate 202.

The present invention includes apparatus to facilitate placement ofprocessing tool bodies in a fab and the methods for using suchplacement. The chassis 101 design can be capable of assuming two definedpositions; one extended position places an interface plate external tothe environment that the tool assumes when it is processing. This allowsfor easy placement and removal. The other position can be the locationwhere the tooling sits when it is capable of processing. The exactplacement of the tooling afforded by the chassis 101 allows for morerational interconnection to facilities and utilities and also for theinterfacing of the tool body 201 with fab automation. The chassis 101can have automated operations capabilities that interfaces with the toolbody and the fab operation to ensure safe controlled operation.

In another aspect of the invention, a processing tool 200 can transfer amaterial, such as, for example, a semiconductor substrate, in and out ofa tool body 201. In FIG. 2, a tool port 211 can be used for coordinatingtransfer of a material into and out of the tool port 211 and maintainingcleanspace integrity of a tool body 201 interior. As can be seen in FIG.2 this embodiment contemplates placing the tool port 211 in a mannerphysically connected to the tool body 201. A further purpose of themovement of the chassis plate 110 from its extended position to itsclosed position would be the movement of the tool port 211 through anopening in a clean space wall. This would allow the tool port 211 tooccupy a position in a clean space so that fabricator logisticsequipment can hand off wafers and carriers of wafers to the tool port211.

Referring now to FIG. 3, in some embodiments, a tool body 201 caninclude a specifically located set of tool connections 310 forconnecting the tool body 201 to facility supplied utilities. When thetool and chassis are moved from an extended position as shown in FIG. 1to a closed position as shown in FIG. 5, such movement can place toolconnections 310 in proximity to the connections for non-electricalutilities 121 and thereby allow for connection of various utilities. Insome embodiments, as a processing tool 200 is connected, various aspectsof tool automation electronics can monitor the connection and determinewhen the connections are in a safe operating mode. Such tool automationelectronics can communicate to the tool body 201 and to the chassis 101to identify a state that the connections and supply conduits are in.operating mode. Such tool automation electronics can communicate to thetool body 201 and to the tool chassis 211 to identify a state that theconnections and supply conduits are in.

In still another aspect of the invention, in some embodiments, controlautomation can be contained within the chassis for various aspects ofthe operation of the chassis 101. It is within the scope of the presentinvention to monitor and control multiple states related to the chassis101 via electronic included in the chassis 101. Such states can include,by way of example, a physical location of a chassis 101 in an extendedor closed state. Therefore, for example, if a processing tool 200 andchassis 101 are in a closed and operational state, a technical operatorissues a command to the chassis 101 to move to an extended location.Such communication could occur through a control panel 122 or throughwireless communication to the chassis 101 through wireless interface123. Control of the processing tools can be accomplished with any knownmachine controller technology, including for example a processor runningexecutable software and generating a human readable interface. beaccomplished with any known machine controller technology, including forexample a processor running executable software and generating a humanreadable interface.

In some embodiments, a command to move to the chassis 101 to an extendedlocation can also initiate, amongst other algorithmic functions, a checkfor the status of utilities connections. It is also within the scope ofthis invention to require any such utility connections to be renderedinto a state of disconnect before the chassis 101 can proceed to anextended position.

Similarly, in some embodiments, prior to operations such as extension ofa chassis 101, processing steps can determine that a tool body 201 didnot contain any substrates prior to extension of the chassis 101. It isalso within the scope of the present invention for communication modesincluded within the chassis 101 to communicate with fab wide automationsystems for purposes such as tracking the location of substrates;tracking the identity of tools; and tracking the status of processingtools. If connections to a processing tool 200 and chassis 101 are in aproper state then the chassis can move into an extended positionallowing for removal of the tool body 201 and replacement with a similartool body 201.

In some embodiments of the present invention, a fabricator will includeautomation to handle substrates and control their processing. And, inmany cases the substrates can move from tool to tool in a specializedcarrier which contains the substrates. The specialized carriers can betransported via automation which includes automated transport systems.The carriers can thereby be presented to one or more processing toolinterfaces, also referred to herein as a “port”. The automation allowsfor movement of the substrates around the fab and for loading andunloading the substrates from a processing tool. Substrates can include,for example and without limitation, wafers for semiconductor processing,microelectronic machines, nanotechnology, photonic, and biotechnologicalcarriers.

A substrate processing tool port can support processing tools and handlewafers and wafer carriers in an environment attached to the tool body.The tool port can penetrate a clean space containment wall and the toolbody can enable routine placement and replacement into the fabricatorenvironment.

As described above, according to the present invention, processing toolsreside with their tool bodies in a position which allows the tool bodyto be outside of a cleanspace with a tool port operatively attached tothe tool body inside of the cleanspace. For example, embodiments caninclude a tool body adjacent to, or on the periphery of, a clean spaceof the fabricator and the tool port extending into the cleanspace. Eachtool body can be removed and replaced in a standardized process andwithout requiring the removal of adjacent tool bodies. The presentinvention also anticipates the automated transfer of substrates from afirst tool port of a first processing tool to a second tool port of asecond processing tool, while maintaining the substrate in a clean spaceenvironment via a clean carrier.

Referring now to FIG. 4, a fab 410 is illustrated with a tool body 411extended in a position for access. The access may include, for example,installation, removal or service. The tool body 411 is mounted to achassis 401. Another tool location 412 is illustrated in a closedposition or an operating position.

As described above, according to the present invention, processing toolsreside with their tool bodies in a position which allows the tool body411 to be outside of a cleanspace with a tool port operatively attachedto the tool body inside of the cleanspace. For example, embodiments caninclude a tool body 411 adjacent to, or on the periphery of, acleanspace of the fabricator and the tool port extending into thecleanspace. Each tool body can be removed and replaced in a standardizedprocess and without requiring the removal of adjacent tool bodies. Thepresent invention also anticipates the automated transfer of substratesfrom a first tool port of a first processing tool to a second tool portof a second processing tool, while maintaining the substrate in acleanspace environment via a clean carrier.

Embodiments therefore include tool ports that are capable of receiving acarrier from the automated transport system. Each carrier can contain atleast one substrate. The automated transport unloads the carriers andpasses the carrier off to the processing tools automation systems. Insome embodiments, the port size enables it to span a wall used for thedefinition of a primary clean space of the fabricator. Inside theprimary clean space resides the entry area of the tool port. The toolport's body can span a distance in excess of the width of the cleanspace wall to allow for substrates which are unloaded from their carrierto be robotically handed off to the tool body's automation.

The novel tool port can incorporate various levels of automated carrierand substrate handling apparatus. For example, in some embodiments, thecarrier and handling apparatus can include communication systems whichreceive data from electronic sensors monitoring each port, processingtools and transport apparatus. In another aspect, a substrate can becontained within a controlled ambient environment while it is within thestorage carrier, port and processing tool.

Substrate Handling

Referring now to FIG. 6, the present invention provides methods andapparatus for handling substrate carriers in a way that is consistentwith routine placement and replacement of the processing tool body 604.A processing tool body 604 is illustrated, in generic fashion, whichcontains processing equipment for processes commonly used in fabricatingsemiconductor devices. The processing tool body 604 is illustrated withhandles to clearly indicate the ability of the processing tool body 604to be removed from its processing position. The tool port 601 extendsfrom the processing tool body 604. In some embodiments, the tool port601 extends a sufficient distance to traverse an associated clean roomwall and be in position for the port entry 603 or “mouth” to receive andhand off substrates.

In some embodiments, the processing tool body 604 resides in a secondarycleanspace which is independent of the primary cleanspace. Separation ofthe primary cleanspace and the secondary cleanspace is accomplished viaa sealing mechanism 602. The sealing mechanism 602 can include, forexample, a collapsible ring of material that when pushed against asealing surface forms an atmospheric seal.

Referring now to FIG. 7, closeup tool body 710 is shown at a closerperspective including the seal 702 around the tool port 701 and sidepanels around the inside removed.

FIG. 8 illustrates a close up of an embodiment of the internalcomponents of a tool port 601. A cassette loading and unloadingapparatus 810 is automatically operative to open a cassette (not shown)and insert or remove a substrate according to a software instructionreceived. A substrate 811 is illustrated being removed from the cassetteloading and unloading apparatus 810. The substrate 811 is shown sittingon a holder 812, such as, for example, a vacuum actuated holder. Theholder 812 is connected to a retractable handler arm 813. Theretractable handler arm 813 can be operative to move the holder 812 anda substrate into and out of a cassette. A rotation platen 814 supportsthe retractable handler arm 813 and is capable of positioning theretractable handler arm 813 along an arcuate path.

In some exemplary embodiments, a cassette containing a substrate 811 isloaded by a fabricator automation robot into the “mouth” of a cassetteloading and unloading apparatus 810. Inside the cassette loading andunloading apparatus 810, the cassette can be opened, thereby exposing asubstrate 811 contained there. In some embodiments, the cassettemaintains a cleanspace environment for the substrate 811 contained inthe cassette. In addition, the environment of the unloading apparatus isalso a cleanspace thereby keeping the substrate 811 in a cleanspaceenvironment after it is unloaded.

The retractable handler arm 813 extends into the cassette and securesthe substrate 811 with an actuated attachment mechanism, such as forexample a vacuum tip. The retractable handler arm 813 is then retractedback out of the cassette unloader. In some embodiments, the retractablehandler arm 813 centers over the rotation platen 814. A rotation ofrotation platen 814 with the arm centered would lead to the minimumamount of space required. Once the arm has rotated towards the toolbody, the arm can again extend allowing the wafer to be placed in areceiving location of the processing tool body 604. After processing,the substrate 811 can be moved back to a receiving location and pickedup by the holder 812. By reversing the above steps the substrate 811 canbe transferred back to a carrier for handoff to the fabricatorautomation. The fabricator automation can transport the substrate to anadditional processing tool for further processing by the additionaltool.

FIG. 9 illustrates perspective view of how a port according to thepresent invention is operatively attached to a tool which is easilyplaced and replaced. In some embodiments, a fabricator 901 has a seriesof tools 902 which may be stacked. When a tool is being placed orreplaced it sits in a retracted position 905 relative to a normalposition in a fabricator. The tool body, 904, is shown in its retractedposition, 905. As illustrated, the tool port 903, is located on a sideof the tool body 904 with the furthest edge just visible.

FIG. 10 shows a perspective of the fabricator 901 from the opposite sideof the primary cleanspace 910, illustrated in FIG. 9. The backfabricator walls have been cut away in order to illustrate an innerportion of the fabricator 901, including multiple tool ports, such as,for example as exemplified by tool port 1001. Tool port 1001 is attachedto a tool body 904 that is fully advanced into the fabricator and in thenormal position.

According to some embodiments, while a tool body is located in thenormal position, a seal is formed against the sealing surface 1002maintaining the integrity of the cleanspace into which the tool port1001 extends. As illustrated, the tool body 904 connected to the toolport 1001 extends away from the clean room wall 1010. In this position,the tool port 1001 is able to interface with transport automation 1013situated on a rail 1012. In some embodiments, a robot arm would indexfrom the transport automation 1013 to a correct tool port 1001 positionby moving horizontally on rail 1012 while that rail moved along thevertical rail system 1011. Any other known transport automation cansimilarly be employed to position the tool port 1001. When transportautomation 1013 is located in a programmed position, the rail 1012 movesforward to hand a wafer cassette to the tool port 1001.

In another aspect, the cleanliness of the clean environment offabricator 901 and each individual port can be facilitated bytransporting equipment on the rail 1012 to a tool port 1001 and open thetool port 1001 to flow liquids or gasses over the internal surfaces ofthe tool port 1001 in order to facilitate particulate and film cleaning

Some embodiments of the present invention which relate to the specificapplication of semiconductor fabrication have been described in order tobetter demonstrate various useful aspects of the invention. However,such exemplary descriptions are not meant to limit the application ofthe inventive concepts described herein in any way. Embodiments maytherefore include, for example, applications in research and generationof: pharmaceutical products, nanostructure products and otherapplications which benefit from the availability of cleanspace andmultiple processing tools.

Referring now to FIG. 11, a cleanspace based fabricator 1110 accordingto some embodiments of the present invention is depicted. One side ofthe cleanspace illustrates a peripheral location 1120 from whichcomponent assemblies are accessible. A first component assembly 1130 anda second component assembly 1140 are located in a cleanspace basedfabricator 1110 and accessible from a peripheral location 1120 of thecleanspace based fabricator 1110. Each tool is made up of multiplecomponent assemblies such as first component assembly 1130 and secondcomponent assembly 1140 (as illustrated in FIG. 12). Second componentassembly 1140, is shown in an installed orientation in the processingenvironment.

Referring now to FIG. 12, a tool 1201 is illustrated with multiplecomponent assemblies 1202-1206. Each component assembly includes somesubset or sub-assembly of the tool 1201. A component assembly caninclude, for example: a reaction chamber of a CVD reactor; the metaldeposition chamber of a metal deposition tool; a chemical tank of a wetchemical processing tool; and the ion source of an ion implant tool forexample. According to some embodiments of the present invention,component assemblies 1202-1206 are accessible individually, in a similarfashion to accessing entire processing tools which can be accessible,from the periphery of a cleanspace.

Referring now to FIG. 13, a magnified section 1310, of an exemplaryfabricator according to some embodiments of the present invention isdepicted. A component assembly 1330 is depicted in a non-installedposition. A second tool 1320 may have an exact replica 1340 of thecomponent assembly 1330, only the second tool 1320 is illustrated withthe exact replica 1340 in an installed position, wherein a portion ofthe second tool 1320 is able to operate in communication with acleanspace portion of the fab. Illustrated in an installed position,wherein a portion of the second tool 1320 is able to operate incommunication with a cleanspace portion of the fab.

According to the present invention, a component assembly 1330 may beaccessed and replaced from the periphery of the cleanspace portion ofthe fab. Multiple purposes may be furthered by accessing a componentassembly 1330 from the periphery of the fab. For example: a componentassembly 1330 may have reached a lifetime for preventive maintenance; itmay be malfunctioning; or it may have an engineering design changeimplemented to improve its function. Those schooled in the art willrecognize that numerous other reasons may be served from the removal ofa component assembly 1330 from a cleanspace environment into a locationfrom which component assemblies may be accessed.

The issues that need to be dealt with for a component assemblyreplacement are generally similar in nature and solution as the issuesrelated to reversibly removable tooling. The connection of the componentassemblies to utilities or other support mechanisms such as, forexample: electrical power, gasses, wafer handling or other supportmechanisms can have similar requirements and solutions.

GLOSSARY OF SELECTED TERMS

Air receiving wall: a boundary wall of a cleanspace that receives airflow from the cleanspace.

Air source wall: a boundary wall of a cleanspace that is a source ofclean airflow into the cleanspace.

Annular: The space defined by the bounding of an area between two closedshapes one of which is internal to the other.

Automation: The techniques and equipment used to achieve automaticoperation, control or transportation.

Ballroom: A large open cleanroom space devoid in large part of supportbeams and walls wherein tools, equipment, operators and productionmaterials reside.

Batches: A collection of multiple substrates to be handled or processedtogether as an entity

Boundaries: A border or limit between two distinct spaces—in most casesherein as between two regions with different air particulate cleanlinesslevels.

Circular: A shape that is or nearly approximates a circle.

Clean: A state of being free from dirt, stain, or impurities—in mostcases herein referring to the state of low airborne levels ofparticulate matter and gaseous forms of contamination.

Cleanspace: A volume of air, separated by boundaries from ambient airspaces, that is clean.

Cleanspace, Primary: A cleanspace whose function, perhaps among otherfunctions, is the transport of jobs between tools.

Cleanspace, Secondary: A cleanspace in which jobs are not transportedbut which exists for other functions, for example as where tool bodiesmay be located.

Cleanroom: A cleanspace where the boundaries are formed into the typicalaspects of a room, with walls, a ceiling and a floor.

Core: A segmented region of a standard cleanroom that is maintained at adifferent clean level. A typical use of a core is for locating theprocessing tools.

Ducting: Enclosed passages or channels for conveying a substance,especially a liquid or gas—typically herein for the conveyance of air.

Envelope: An enclosing structure typically forming an outer boundary ofa cleanspace.

Fab (or fabricator): An entity made up of tools, facilities and acleanspace that is used to process substrates.

Fit up: The process of installing into a new clean room the processingtools and automation it is designed to contain.

Flange: A protruding rim, edge, rib, or collar, used to strengthen anobject, hold it in place, or attach it to another object. Typicallyherein, also to seal the region around the attachment.

Folding: A process of adding or changing curvature.

HEPA: An acronym standing for high-efficiency particulate air. Used todefine the type of filtration systems used to clean air.

Horizontal: A direction that is, or is close to being, perpendicular tothe direction of gravitational force.

Job: A collection of substrates or a single substrate that is identifiedas a processing unit in a fab. This unit being relevant totransportation from one processing tool to another.

Logistics: A name for the general steps involved in transporting a jobfrom one processing step to the next. Logistics can also encompassdefining the correct tooling to perform a processing step and thescheduling of a processing step.

Multifaced: A shape having multiple faces or edges.

Nonsegmented Space: A space enclosed within a continuous externalboundary, where any point on the external boundary can be connected by astraight line to any other point on the external boundary and suchconnecting line would not need to cross the external boundary definingthe space.

Perforated: Having holes or penetrations through a surface region.Herein, said penetrations allowing air to flow through the surface.

Peripheral: Of, or relating to, a periphery.

Periphery: With respect to a cleanspace, refers to a location that is onor near a boundary wall of such cleanspace. A tool located at theperiphery of a primary cleanspace can have its body at any one of thefollowing three positions relative to a boundary wall of the primarycleanspace: (i) all of the body can be located on the side of theboundary wall that is outside the primary cleanspace, (ii) the tool bodycan intersect the boundary wall or (iii) all of the tool body can belocated on the side of the boundary wall that is inside the primarycleanspace. For all three of these positions, the tool's port is insidethe primary cleanspace. For positions (i) or (iii), the tool body isadjacent to, or near, the boundary wall, with nearness being a termrelative to the overall dimensions of the primary cleanspace.

Planar: Having a shape approximating the characteristics of a plane.

Plane: A surface containing all the straight lines that connect any twopoints on it.

Polygonal: Having the shape of a closed figure bounded by three or moreline segments

Process: A series of operations performed in the making or treatment ofa product—herein primarily on the performing of said operations onsubstrates.

Robot: A machine or device that operates automatically or by remotecontrol, whose function is typically to perform the operations that movea job between tools, or that handle substrates within a tool.

Round: Any closed shape of continuous curvature.

Substrates: A body or base layer, forming a product, that supportsitself and the result of processes performed on it.

Tool: A manufacturing entity designed to perform a processing step ormultiple different processing steps. A tool can have the capability ofinterfacing with automation for handling jobs of substrates. A tool canalso have single or multiple integrated chambers or processing regions.A tool can interface to facilities support as necessary and canincorporate the necessary systems for controlling its processes.

Tool Body: That portion of a tool other than the portion forming itsport.

Tool Port: That portion of a tool forming a point of exit or entry forjobs to be processed by the tool. Thus the port provides an interface toany job-handling automation of the tool.

Tubular: Having a shape that can be described as any closed figureprojected along its perpendicular and hollowed out to some extent.

Unidirectional: Describing a flow which has a tendency to proceedgenerally along a particular direction albeit not exclusively in astraight path. In clean airflow, the unidirectional characteristic isimportant to ensuring particulate matter is moved out of the cleanspace.

Unobstructed removability: refers to geometric properties, of fabsconstructed in accordance with the present invention that provide for arelatively unobstructed path by which a tool can be removed orinstalled.

Utilities: A broad term covering the entities created or used to supportfabrication environments or their tooling, but not the processingtooling or processing space itself. This includes electricity, gasses,airflows, chemicals (and other bulk materials) and environmentalcontrols (e.g., temperature).

Vertical: A direction that is, or is close to being, parallel to thedirection of gravitational force.

While the invention has been described in conjunction with specificembodiments, it is evident that many alternatives, modifications andvariations will be apparent to those skilled in the art in light of theforegoing description.

Accordingly, this description is intended to embrace all suchalternatives, modifications and variations as fall within its spirit andscope.

1-20. (canceled)
 21. An apparatus for processing a substrate comprisinga chassis for positioning a component assembly portion of a processingtool on a periphery of a primary cleanspace of a fabrication facility,the apparatus comprising: the fabrication facility comprising theprimary cleanspace; the processing tool comprising a tool body and atool port, wherein the processing tool is on the periphery of theprimary cleanspace; the chassis supporting a base plate for mounting thecomponent assembly onto, said chassis comprising an extended positionand an operating position, wherein the operating position places thecomponent assembly into the processing tool and the extended positionplaces at least a portion of the component assembly on a periphery ofthe processing tool; wherein the base plate comprises a mating surfacefor receiving the component assembly; and wherein the extended positionpositions the component assembly for access and replacement from theperiphery of the processing tool.
 22. The apparatus of claim 21 whereinthe mating surface comprises tabs protruding from the surface, whereinthe tabs are functional for aligning the component assembly receivedthereon.
 23. The apparatus of claim 22 wherein the tabs are additionallyoperative for providing electrical connection for one or more of:electrical power and data signal to terminals comprising the componentassembly.
 24. The apparatus of claim 21 additionally comprising a flangeportion operative to connect utility service conduits to the componentassembly, said utility services comprising one or more of: chemical gassupply; liquid supply; electric power supply; and data signalconnection.
 25. The apparatus of claim 24 wherein the flange comprisesmultiple primary sealing surfaces, each primary sealing surface forsupply of a discrete utility service.
 26. The apparatus of claim 25wherein the flange additionally comprises one or more secondary sealingsurfaces operative to seal a material leaking from the primary sealingsurface from entering an ambient atmosphere.
 27. The apparatus of claim24 wherein the flange additionally comprises a circular rubber sealaround a perimeter of said flange and operative to maintain liquid andgaseous separation between and interior of said flange and an exteriorof said flange.
 28. The apparatus of claim 24 wherein the flangeadditionally comprises a channel for maintaining a negative atmosphericpressure around a seal containing the chemical gas, said negativeatmospheric pressure operative to evacuate any chemical gas leaking fromthe seal to an area external to the cleanspace.
 29. The apparatus ofclaim 21 additionally comprising a rail on which the base plate canslide from the extended position to the operating position.
 30. Theapparatus of claim 21 additionally comprising a substrate carrier. 31.An apparatus comprising a flange set for connecting a componentassembly, the apparatus comprising: a fabricator comprising a verticallyoriented cleanspace; a component assembly proximate to a periphery ofthe vertically oriented cleanspace; the flange set comprising: a firstsealing surface connected to multiple conduits, with a primaryconnection point for each conduit formed in the first sealing surface, asecond sealing surface with multiple secondary connection points eachsecondary connection point positioned to interface with a respectiveprimary connection point, a seal attached to one or more primaryconnection point, wherein said attachment of the seal isolates aninterior defined by the seal from an exterior defined by the seal, oneor more areas formed about each secondary connection point for receivingeach respective seal when the first sealing surface is brought proximateto the second sealing surface, a fastener for holding the first sealingsurface and the second sealing surface; and wherein the extendedposition positions the component assembly for access and replacementfrom the periphery of the vertically oriented cleanspace of thefabricator.
 32. The apparatus of claim 31 additionally comprising: acontiguous channel circumventing an aggregate of the primary connectionpoints; a channel seal atmospherically sealing an interior area definedby the contiguous channel; a fixture for connecting a source negativeatmospheric pressure to the channel; and at least one electronic sensoroperative to monitor one or more gases leaking from the primaryconnection points.
 33. The apparatus of claim 31 additionallycomprising: a contiguous channel circumventing an aggregate of theprimary connection points; a channel seal atmospherically sealing aninterior area defined by the contiguous channel; a fixture forconnecting a fluid drain to the channel; and electronic sensorsoperative to monitor one or more fluids leaking from the first sealingsurface or the second sealing surface.
 34. The apparatus of claim 31additionally comprising a substrate carrier.
 35. An apparatuscomprising: a fabricator comprising a primary cleanspace; a firstsupport for mounting a component assembly, wherein the first support islocated on a periphery of the primary cleanspace, and wherein the firstsupport is capable of removing said component assembly withoutdisturbing integrity of the primary cleanspace, the first supportcomprising mechanisms for specific location of the component assembly,and mechanisms for connection and disconnection of one or more of:electrical power, data transmission, a gas, a liquid, a powder, andnegative atmospheric pressure; and wherein the first support positionsthe component assembly for access and replacement from the periphery ofthe primary cleanspace of the fabricator.
 36. The apparatus of claim 35additionally comprising apparatus operative to physically remove andinstall the component assembly into a processing tool.
 37. The apparatusof claim 35 wherein the first support is installed into a processingtool body within a cleanspace fabricator.
 38. The apparatus of claim 35additionally comprising a substrate carrier.
 39. The apparatus of claim38 additionally comprising: a second support for mounting a secondcomponent assembly, wherein the second support is located on theperiphery of the primary cleanspace; wherein the second support iscapable of removing the second component assembly without disturbingintegrity of the primary cleanspace; wherein the second supportcomprises mechanisms for specific location of the second componentassembly, and mechanisms for connection and disconnection of one or moreof: electrical power, data transmission, a gas, a liquid, a powder, andnegative atmospheric pressure; wherein the second support positions thecomponent assembly for access and replacement from the periphery of theprimary cleanspace of the fabricator; and wherein the second support islocated vertically above the first support.